Aromatic diamines -ether linkage-
These monomers are the raw materials of the thermosetting resin. The thermosetting resin made from these monomers is excellent in heat resistance, adhesive property, and flexibility.
1,-Bis(3-aminophenoxy) benzene
| Features | Lower cost than APB |
| Application | Heat-resistant resin, varnish and adhesive (polyimide) |
| Purity % | 97 Min |
| Appearance | Pale brown fine granule |
| Melting point | 107-110 degrees C |
| CAS No. | 10526-07-5 |
| TSCA | Have inventory |
| EINECS/ELINCS | 234-082-6 |
| ENCS | (03)-3948 |
| ISHL | 4-(14)-179 |
2,2-Bis[4-(4-aminophenoxy)phenyl]propane
| Application | High performance polyimide |
| Purity % | 99 Min |
| Appearance | off-white powder |
| Melting point | 126 degrees C |
| CAS No. | 13080-86-9 |
| TSCA | Have inventory |
| EINECS/ELINCS | 235-985-8 |
| ENCS | (4)-1581 |
| ISHL | 7-(4)-721 Lab sample |
4,4’-Diaminodiphenylether
4,4’-DADPE
| Features | The thermosetting resin made from ODA is excellent in heat resistance, adhesive properties, and flexibility, |
| Application | Heat-resistant resin, varnish and film (polyimide, polyamide), epoxy curing agent |
| Purity % | 99 Min |
| Appearance | Gray crystalline powder |
| Melting point | 191.5 degrees C |
| CAS No. | 101-80-4 |
| TSCA | Have inventory |
| EINECS/ELINCS | 202-977-0 |
| ENCS | (3)-854 |
| ISHL | (3)-854 |