ICROS™ TAPE (Ultra clean protective tape)

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Backgrinding Wafer Tape

ICROS Tape is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since ICROS TAPE uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents. The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.

No rinsing needed:

Lamination process: