High-clean adhesive tape

Usage detail

Protective tape for formed circuit on wafer surface during the back grinding process of the semi-conductor manufacturing process


Please visit http://www.mc-tohcello.co.jp/icros/ to get more information about this product.

  • Basic information

ICROS™ Tape has been the world top BG (Back grinding) tape for many decades. Now, our tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow. Please refer to each tape explanation for more details.


Main features of ICROS™ Tape


  • Extremely low contaminated Tape (both UV and Non-UV)
  • Superior total thickness type
  • High adhesion and easy peel
  • High heat resistance & chemical resistant tape
  • Bump absorption of the wafer in the process
  • Custom made possible

Contact Us

Mitsui Chemicals Europe GmbH
TEL +49 (0) 211-17332-0
FAX +49 (0) 211-17332-701